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Solder Voids BGA

PCBA Assembly | Assembly Defects

PCB Assembly Defects Solder Bridging Tombstoning Voids
Byroot 2026-07-112026-07-11

Master PCB assembly defects: solder bridging, tombstoning, and voids. Learn root causes, advanced prevention techniques, and reliable solutions from industry experts to boost yield and reliability. 1. Solder Bridging: Causes, Prevention, and Detection Solder bridging occurs when molten solder creates an unintended electrical connection between two or more adjacent conductors, such as pads, pins, or…

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