Lamination Process for Multilayer PCBs

The lamination process for multilayer PCBs is the critical step where individual layers of copper-clad laminate and prepreg are bonded into a single, robust board under controlled heat and pressure. For B2B buyers designing high-speed digital, RF, or HDI boards, mastering this process ensures reliable, defect-free production. 1. Material Preparation for Lamination Process for Multilayer…